Application date 2015. 12. 09 Applicant Shanghai Xinyang Semiconductor Materials Co., Ltd. Address 201616, No. 3600, Sixian Road, Songjiang District, Shanghai Inventor Wang Su Li Shugang Patent agency Shanghai Xinhao Patent Agency (General Partnership) 31249 Agent Jia Huiqin Name of invention An electric inhibitor for copper plating and its use The present invention discloses that the present invention provides an inhibitor for copper electroplating and its use. The inhibitor is a polyvinylamine polymer substituted with barbituric acid or its derivatives. The copper electroplating solution prepared by using the inhibitor of the present invention is particularly suitable for filling blind holes of integrated circuit substrates, and can effectively avoid the bump phenomenon of copper plating metal above the holes. |
An electroplated copper Use inhibitors and their uses.pdf
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