Dow Corning and IBM jointly develop thermal gel and win an award
A global leader in silicones, silicon-based technology and innovation Dow Corning’s TC-3040 thermal gel won the 2016 R&D100 Award. The product is a silicon-based thermal interface material (TIM-1) for thermal management developed jointly by Dow Corning and IBM, which can improve the performance stability of advanced semiconductor chip applications. Dow Corning and IBM jointly developed…
