Driven by the rapid development of the semiconductor industry, the market size of epoxy plastic sealants continues to expand

Epoxy plastic sealing compound, also known as epoxy resin molding compound, refers to a powdery molding compound made of epoxy resin as the base resin and mixed with high-performance phenolic resin curing agent, silica powder filler and various additives. Epoxy plastic encapsulation compound is a type of thermosetting chemical material used for chip packaging. It…

Driven by the rapid development of the semiconductor industry, the market demand for PBN (pyrolytic boron nitride) is vast.

PBN, the full name of pyrolytic boron nitride, refers to boron nitride prepared through pyrolysis reaction at extremely high temperatures. It belongs to a category of advanced inorganic non-metallic materials. PBN purity is as high as 99.999%, colorless and odorless, white powder in appearance, with good density, high temperature resistance, insulation, oxidation resistance, air tightness,…

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