Henkel Launches Ultra-High Thermal Conductivity Pressureless Sintered Die Attach Meets Automotive-Grade Reliability Standards
● 165 W/m-K high thermal conductivity material for high reliability power discrete packaging in automotive and industrial applications Henkel Announces Loctite Ablestik ABP 8068TI adds to its growing portfolio of high thermally conductive die attach adhesives. This new pressureless sintered die attach adhesive has a thermal conductivity of 165 W/m-K, the highest thermal conductivity in…
