Driven by the rapid development of the semiconductor industry, the market size of epoxy plastic sealants continues to expand

Epoxy plastic sealing compound, also known as epoxy resin molding compound, refers to a powdery molding compound made of epoxy resin as the base resin and mixed with high-performance phenolic resin curing agent, silica powder filler and various additives. Epoxy plastic encapsulation compound is a type of thermosetting chemical material used for chip packaging. It…

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